Advanced process & package technology development technical manager

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation Program ManagerThe ASIC Package Design Principal Technical Program Manager (TPM) is responsible for TPM represents both package design and assembly process engineering in Product Development Team (PDT ResponsibilitiesMaintain ASIC packaging roadmapAccountable for package technical requirements specifications costing for solutionsCollaborate with ASIC Package Design & ASIC assembly process engineering to maintain

Provide highest level of technical expertiseCollaborate closely with Plant. Production manager, molding maintenance and automation teams, quality and process development on performance process improvements development, process development, quality engineering, injection molding technology, process automation metrology sensor technology, process and system V&V, regulatory complianceKnowledge and experience in applying statistical analysis methodologies and tools, Design of Experiments (DoE).Advanced knowledge

Job DescriptionAdvanced packaging technology developmentRequirement1. Advanced new product introduction technology development (new product trial production planning, DRC Familiar with advanced chiplet and 3DIC packaging technology development3. Have practical experience in Layout process reliability5. Development experience in common optical packaging technology8.

As a part of AMD packaging R&D team, you will drive new technology development, collaborate with internal Support package development activities as an integration engineer, including various research, DOE planning development and process integration Knowledge of adv. packaging manufacturing processes e.g. Support package development activities as an integration engineer, including various research, DOE planning development and process integration Knowledge of adv. packaging manufacturing processes e.g.

in collaboration with Technology Development team and FSM fab managers.This job requisition is to seek reporting to FEOL Process Integration Engineering Development manager. Development and Local Yield teams to import new technology to production fabs. Working level understanding on Device Physics and experience in advanced nodes (FinFET technology, GAA Experience in new semiconductor technology development.

and implementation of new products and enhancements within the process technology group.Participates practical applications of scientific theory in the development and ongoing technical management of the ApplicantOver 12 years of experience in the semiconductor industry, specializing in advanced packaging technology.Demonstrated expertise in technical project management, customer interaction, and proficiency in advanced packaging tools.Strong knowledge in hybrid packaging.Exceptional communication skills in

We utilize latest process technology, advanced EDA tools, and sophisticated design methodology. Redhawk)Experience in Clock Power Distribution, P&R, Timing closure, RC Extraction, and verification on advanced technology nodes2. years of experience in above areas Ways to stand out from the crowd MS in Engineering or ScienceKnowledge in FinFET technology, circuit design, and package designExperience in physical verification

the company setting the strategic direction for the semiconductor advanced 2.5D 3D packaging and Advanced strategic engagements, and guidance for technical support across Entegris's global technology portfolio industry.Develops and drives the corporate advanced packaging technology strategy for the company to initiatives for strategic customers and partnersAlign cross divisional product development activities advanced packaging technology roadmaps aligned to customer and industry needs and ensures alignment

Siemens EDA is a global technology leader in Electronic Design Automation software. Packaging High Speed Advanced Product Engineer Hsinchu City, Taiwan We are looking for a talent of Foundry Responsible activities will bedelivering reference design flows for foundry products and participating in the development Familiarity with the Package Design process is required. Have a desire to broaden exposure to the business aspects of the technical design world.

one of the world's leading analytical instrumentation companies, Bruker covers a broad spectrum of advanced solutions in all fields of research and development. summary, technology roadmap and present to customer technical executive level.Formulate and lead the managers, and general managers regarding our customers' requirements for leading edge semiconductor process Communicate at an advanced technical level with customers, enhancing Bruker's credibility and building