Real-Time Defect Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR71058 Real-Time Defect Engineer (Evergreen)

As a Real-Time Defect Analysis Engineer at Micron Technology, Inc., you will be working with a team of other process and equipment engineers responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. This position will identify, diagnose and resolve process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation / optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Job Responsibilities

Identify yield gain

Plan and implement baseline improvement program to drive the yield and meet yield target Ensure process control charts set up properly, with correct limits and reaction mechanism Understand defect morphology, transformation and ensure defect library is updated promptly

Ensure adequate sampling for the processes for timely execution of conversions Meet and work with Process Integration, Production, and other process areas. Follow up on all defects related SWRs

Setting up contamination, defect, and performance qualification procedures and frequency

Characterizing the process response to parameters

Defining the process margin with respect to upstream and downstream steps

Qualifying conversions and new processes

Reducing scrap and excursions

Study new method for defect analysis