Senior Principal Engineer HV BCD expert

Operations 3rd Party Foundries :

Co-ordinate all Wafer Manufacturing related activities.

Ensure available capacity is in place to cover both STP and LTP volumes. Taking into account type split and capacity bottlenecks.

Drive BBSC for all 3rdParty Foundries for Delivery through put time Yield and Quality including follow up on improvement actions

Monitor review and manage any process changes/improvements supporting requests both from 3rd Party Foundries to BLs and from BLs to 3rd Party Foundries.

Co-ordinate and drive solutions to customer complaints hold lots and yield/processing excursions related to 3rdParty Foundry ensuring route cause is understood and corrective actions are in place.

Program management 3rdParty Foundries:

Define time-line resources risk-mitigations (technical & non technical)activities to ensure timely and satisfactory completion of the project

Be responsible for monitoring and controlling the execution of the project as per agreed time-line

Drive all new product transfers activities in External Foundries with support of NXP project team (Innovation mother fab BL) and local project team of External Foundry

Actively coordinate process qualification product introduction and qualification

Stimulate/oversee structural problems solving by use of statistical and quality tools

Chair and organize process gate meetings

Report to NXP stakeholders and External Foundries counterparts (PRB/Steering Committee)

Be the interface between NXP and External Foundries during project execution

Coordinate safe-launch and volume ramp-up implementation monitor with support of the local technical team continuous yield & process improvement activities

General areas of responsibility include:

Relation management and communication interface to all 3rdParty Foundries within their area.

Drive Quarterly review with 3rdParty Foundries including follow up on actions

Support Foundry Sourcing group in cost/price negotiations and discussions with both existing and new 3rd Party Foundries

Job Requirement :

Minimum Qualifications:

Bachelor/Master in Engineering/Material Science/Electronic

Minimum 7 years working experience preferably in semiconductor fab environment (Process Integration or Device engineer with HV/ BCD experience preferred)

Well verse in English and Chinese

Able to work independently and also handle cross functional projects

Preferred Qualifications:

Six sigma green belt and above SPC knowledge Semiconductor Devices and Process knowledge

Knows statistical tool KLA ACE XP JMP SPS etc

More information about NXP in Greater China...

#LI-7743

Required Experience:

Staff IC

Employment Type : Full-Time
Experience: years
Vacancy: 1