(02)【2025新幹班】半導體 / IC設計類Semiconductor / IC Design

1.熟悉先進封裝製程技術，包括但不限於製程開發、封裝材料選擇及可靠性測試等

Proficient in advanced packaging processes, including process development, material selection, and reliability testing.

2.電機 / 電子、資工 / 資管、機械 / 應力、工工 / 工管、光電 / 物理、材料 / 化工、數學 / 統計等相關背景者尤佳

Backgrounds in Electrical Engineering, Information Management, Mechanical Engineering, Industrial Engineering, Optics & Physics, Materials Engineering or Mathematics & Statistics are highly preferred.

Taipei / 新竹Hsinchu / 台中Taichung）

4萬元或以上）

1.負責半導體IC設計、先進封裝技術、CMP製程整合、品質管理

Responsible for semiconductor IC design, advanced packaging, CMP integration, and quality management.

2.產品領域為消費性電子等

Focus on consumer electronics products.

3.工作地點為台北 / 新竹 / 台中

The job is based in Taipei, Hsinchu or Taichung.