Advanced Package Designer

We are seeking an Advanced Packaging Designer to join our design team. This role will focus on designing, verifying, and documenting innovative IC packaging solutions to meet electrical, mechanical, and thermal requirements while ensuring compliance with industry standards (JEDEC, IPC, ISO) and internal specifications. The designer will collaborate with cross-functional teams to deliver manufacturable, reliable, and audit-ready package designs.

• Develop IC package designs that include a combination of substrate, lead frame, wirebond, flip-chip, wafer-level and other advanced packaging technologies.
• Apply fabrication, assembly and test constraints in designs.
• Generate detailed drawings, 3D models, and documentation for manufacturing and audits.
• Work closely with package design engineers, test engineers, and manufacturing teams.
• Present technical data in actionable, traceable formats for audits and stakeholders.
• Partner with supply chain and quality teams to ensure scalability and reliability.
• Contribute to design workflow automation and standards-driven documentation.
• Support continuous improvement initiatives in packaging design and compliance.
• Ensure packaging designs align with JEDEC, IPC, ISO, and internal design rules.
• Capture requirements into traceable, automation-friendly formats for compliance checklists.
• Benchmark internal packaging specs against industry standards and identify mismatches.

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