Job DescriptionEngineers in High-Speed Signal Integrity Group works with IC designers and system hardware / software engineers to guide them on high-speed SI / PI and system IR drop issues. The candidate is expected to be proactive on the development of SI / PI chip-package-PCB co-design flow for LPDDR4 / 3, DDR4 / 3 and Gbps SerDes TX / RX design. This position offers the opportunity to understand broad spectrum of smart phone, automotive and smart home products and involve in cross-functional engineering discussions on highly-integrated SOC design.
The candidate is responsible for :
1. LPDDR4 / 3 and DDR4 / 3 SI / PI analysis and design
2. Gbps SerDes TX / RX analysis and design
3. System PDN analysis and design
4. Development of SI / PI chip-package-PCB co-design methodologies and validation / correlation with measurements
5. Producing chip / PKG / PCB layout guidelines and reports for customer support
LI-ML2Requirement1. MS or above in Electrical / Communication / Electromagnetic Engineering
2. Familiarity with SI / PI design for LPDDR4 / 3, DDR4 / 3 and Gbps SerDes
3. Familiarity with transmission line theory and it's application to SI / PI design
4. Familiarity with EM tools such as Ansys HFSS / Q3D / Siwave or Sigrity PowerSI
5. Familiarity with HSPICE or Spectre circuit simulator
6. Experience in the following is a plus :
1) Circuit design or chip / system validation for LPDDR4 / 3 or DDR4 / 3
2) HBM SI / PI analysis and design
3) DOE design and analysis
Engineer • HsinChu, Taiwan